FS1862SU is a smart PA chip integrated with FourSemi SDG, which is speaker excursion and temperature protection algorithm, FS Sound audio algorithm and I/V sense function. It has high performance while low power consumption and applies to mobile phones, tablets, smart watches, smart home audio, etc.
FS1894SU is a smart PA chip integrated with FourSemi SDG, which is speaker excursion and temperature protection algorithm, FS Sound audio algorithm and I/V sense function. It has high performance while low power consumption and applies to mobile phones, tablets, smart watches, smart home audio, etc.
FS1818U is a smart PA chip integrated with FourSemi SDG, which is speaker excursion and temperature protection algorithm, FS Sound audio algorithm and I/V sense function. It has low power consumption and mini size, and applies to mobile phones, tablets, smart watches, etc.
FS1896U is a smart PA chip integrated with FourSemi SDG, which is speaker excursion and temperature protection algorithm, FS Sound audio algorithm and I/V sense function. It has low power consumption and mini size, and applies to mobile phones, tablets, smart watches, etc.
FourSemi was founded in 2016. The founding team comes from well-known international semiconductor companies, such as Qualcomm, NXP, Texas Instruments, etc. The core backbone team all have more than 20 years of semiconductor industry experience. FourSemi focuses on high-performance digital-analog hybrid chip design. Products cover smart PA, audio power amplifier, haptics driver, car audio, professional audio system and are widely used in mobile phones, tablets, wearable devices, smart speakers, automotive applications, personal computers , etc.
FourSemi launched domestic Smart PA FS1601 and large power amplifier FS2105 in 2017 and 2021 respectively, achieving a breakthrough in this field in China.
