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Company Philosophy

FourSemi Chronicle of Events
  • 2025

    Established an in-depth cooperative relationship with one of the world's largest manufacturers of new energy vehicles through automotive-grade smart audio chip

  • 2016

    Company established

  • 2017

    Launched the first ASIC DSP Smart PA audio chip in China and achieved commercial sales.

  • 2018

    Entered the ODM supply chain of leading smartphone brands

  • 2019

    Broke into world-famous brands’ ODM supply chain, launched SPC product

  • 2020

    Launched N-DSP Smart PA audio chip product line

  • 2021

    Launched the first domestic high-power smart audio chip and achieved commercial sales Cumulative shipments exceeded 100 million pieces

  • 2022

    Become a direct supplier for one of the world's leading electronics companies

  • 2023

    Haptic driver chips achieved commercial sales Launch the first domestic automotive-grade smart audio chip that has passed AEC-Q100 certification

  • 2024

    Over 1 Billion shipment